Author/Editor		Popa, Ana Maria; Chaix, Jean-Marc
Title		Quantitative image analysis of microstructural changes during solid state sintering of W-Cu composites
Type		članek
Source		Image Anal Stereol
Vol. and No.		Letnik 20, št. Suppl 1
Publication year		2001
Volume		str. 65-70
Language		eng
Abstract		Solid state sintering of W-Cu composites has been performed at 1050degreesC. The microstructure evolution was observed on samples quenched after different sintering times. The microstructure is constituted by 3 phases: tungsten (W), copper (Cu) and pores. During the process, the initial mixture of W and Cu powders is transformed, by migration of Cu and rearrangement of particles. These microstructural changes are studied in order to understand the phenomena and control the materials properties.This papers deals with the different aspects of the quantitative analysis of this evolution. The porous samples are impregnated with a resin under vacuum before being cut and carefully polished. Low voltage (<10 kV) is used during image acquisition in the scanning electron microscope to prevent artifacts. Area fraction measurements are used to check the quality of the images. Classic measurements have been used. The evolution of surface areas of each phase, and of areas of contacts between phases is used to characterize the spreading of Cu onto the surface of W particles. New measurements based on classic methods have also been developed. The analysis of the location of Cu and pores in the interparticular space between W powder was performed on the basis of the 2D "granulometry using openings". It evidences the mechanism of capillary penetration of Cu in the inter-W space, and provides kinetic data for the phenomenon. The aim of this work is to correlate the tungsten powder size to the green microstructure and to the evolution during sintering.
Descriptors		MATERIALS TESTING TUNGSTEN COMPOUNDS COPPER IMAGE PROCESSING, COMPUTER-ASSISTED